This inventor holds 2 USPTO granted patents. Top assignee: Chipmos Technologies Inc.. Active years: 2013-2016.
Location History:
- Tainan County, TW (2013)
- Hsinchu, TW (2016)
Company Filing History:
Years Active: 2013-2016
Title: Innovations of Yu Ting Yang in Electronic Packaging
Introduction
Yu Ting Yang is a notable inventor based in Tainan County, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative designs that enhance thermal management in electronic devices. With a total of 2 patents, Yang's work is recognized for its practical applications in improving the performance and reliability of electronic components.
Latest Patents
One of Yang's latest patents is a thermally enhanced electronic package. This invention comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer, while the insulator fills the gap between the driver chip and the flexible carrier. The carbon nanocapsules are strategically disposed on the driver chip, on the resistant, on the flexible carrier, or within the insulator to enhance heat dissipation of electronic packages.
Career Highlights
Yang is currently employed at Chipmos Technologies Inc., where he continues to develop innovative solutions in the realm of electronic packaging. His work is instrumental in advancing the technology used in various electronic devices, ensuring they operate efficiently under varying thermal conditions.
Collaborations
Yang collaborates with talented individuals such as Tzu Hsin Huang and Hung Hsin Liu, contributing to a dynamic team focused on innovation and excellence in electronic packaging.
Conclusion
Yu Ting Yang's contributions to the field of electronic packaging through his innovative patents demonstrate his commitment to enhancing technology. His work not only improves the performance of electronic devices but also sets a standard for future innovations in the industry.