Chipmos Technologies Inc.

Yu Ting Yang

Geng Shin Shen

An Hong Liu

Tzu Hsin Huang

Hung Hsin Liu

Shih Fu Lee

David Wei Wang

Wei David Wang

A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Thermally enhanced electronic package

Growing community of inventors

Tainan County, Taiwan

Yu Ting Yang