An Hong Liu

Title: An Hong Liu: Innovator in Thermally Enhanced Electronic Packages

Introduction

An Hong Liu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative designs that enhance thermal management in electronic devices. With a total of 3 patents to his name, Liu continues to push the boundaries of technology.

Latest Patents

One of Liu's latest patents is a thermally enhanced electronic package. This invention comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer, while the insulator fills the gap between the driver chip and the flexible carrier. The carbon nanocapsules are strategically disposed on the driver chip, on the resistant, on the flexible carrier, or within the insulator to enhance heat dissipation of electronic packages.

Career Highlights

An Hong Liu is currently employed at Chipmos Technologies Inc., where he applies his expertise in electronic packaging. His work focuses on developing advanced solutions that improve the performance and reliability of electronic devices. Liu's innovative approach has garnered attention in the industry, making him a key figure in his field.

Collaborations

Liu collaborates with talented coworkers, including Tzu Hsin Huang and Yu Ting Yang. Together, they work on various projects that aim to advance technology in electronic packaging.

Conclusion

An Hong Liu's contributions to thermally enhanced electronic packages demonstrate his commitment to innovation in the field of electronics. His patents reflect a deep understanding of thermal management, which is crucial for the performance of modern electronic devices. Liu's work continues to inspire advancements in technology and improve the efficiency of electronic systems.