The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
May. 26, 2011
Applicants:
An Hong Liu, Hsinchu, TW;
David Wei Wang, Hsinchu, TW;
Inventors:
An Hong Liu, Hsinchu, TW;
David Wei Wang, Hsinchu, TW;
Assignee:
Chipmos Technologies Inc., Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/22 (2006.01); H01L 21/00 (2006.01); H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A thermally enhanced electronic package comprises a chip, a substrate, an adhesive, and an encapsulation. The adhesive or the encapsulation is mixed with carbon nanocapsules. The substrate includes an insulation layer and a wiring layer formed on the substrate. The adhesive covers the chip and the substrate. The chip is electrically connected to the wiring layer. The encapsulation covers the chip and the substrate.