The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Jan. 28, 2011
Applicants:
Chun Ying Lin, Tainan County, TW;
Geng Shin Shen, Tainan County, TW;
Yu Tang Pan, Tainan County, TW;
Shih Wen Chou, Tainan County, TW;
Inventors:
Chun Ying Lin, Tainan County, TW;
Geng Shin Shen, Tainan County, TW;
Yu Tang Pan, Tainan County, TW;
Shih Wen Chou, Tainan County, TW;
Assignee:
Chipmos Technologies Inc., Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.