The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Oct. 28, 2016
Applicant:
Chipmos Technologies Inc., Hsinchu, TW;
Inventors:
Tung-Bao Lu, Hsinchu, TW;
Tzu-Han Hsu, Hsinchu, TW;
Assignee:
ChipMOS Technologies Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 31/0328 (2006.01); H01L 31/0336 (2006.01); H01L 31/072 (2012.01); H01L 31/109 (2006.01); H01L 21/00 (2006.01); H01L 33/40 (2010.01); H01L 33/06 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/40 (2013.01); H01L 33/06 (2013.01); H01L 33/62 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A semiconductor light-emitting device including a light-emitting diode chip and an electrode disposed thereon is provided. The electrode at least includes a plated silver alloy (AgY) layer, wherein the Y of the AgYlayer includes metals forming a complete solid solution with Ag at arbitrary weight percentage, and the X of the AgYlayer is in a range from about 0.02 to 0.15. The fabricating method thereof is also provided.