Tung-Bao Lu

Title: Innovations of Tung-Bao Lu

Introduction

Tung-Bao Lu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. With a total of 3 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is for a semiconductor light-emitting device and the fabricating method thereof. This invention includes a light-emitting diode chip and an electrode disposed thereon. The electrode features a plated silver alloy (AgY) layer, where the Y of the AgY layer consists of metals that form a complete solid solution with Ag at arbitrary weight percentages. The X of the AgY layer is maintained within a range from about 0.02 to 0.15. Additionally, he has developed a solder ball that includes a silver ball structure and a shell structure. The shell structure wraps around the surface of the silver ball structure, with the material of the shell including tin. This design ensures that when the solder ball is bonded to other devices, the ball height remains constant to avoid collapse.

Career Highlights

Tung-Bao Lu is currently employed at Chipmos Technologies Inc., where he continues to innovate in semiconductor technologies. His work has been instrumental in advancing the capabilities of electronic devices.

Collaborations

He collaborates with Tzu-Han Hsu, contributing to various projects within the semiconductor field.

Conclusion

Tung-Bao Lu's contributions to semiconductor technology through his patents and work at Chipmos Technologies Inc. highlight his role as a key innovator in the industry. His inventions continue to shape the future of electronic devices.