The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Oct. 19, 2016
Applicant:
Chipmos Technologies Inc., Hsinchu, TW;
Inventors:
Tung-Bao Lu, Hsinchu, TW;
Tzu-Han Hsu, Hsinchu, TW;
Assignee:
ChipMOS Technologies Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 2224/11418 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13541 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/2076 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/20755 (2013.01); H01L 2924/20756 (2013.01); H01L 2924/20757 (2013.01); H01L 2924/20758 (2013.01); H01L 2924/20759 (2013.01);
Abstract
A solder ball includes a silver ball structure and a shell structure. The shell structure wraps a surface of the silver ball structure, and a material of the shell structure at least includes tin. When the solder ball is bonded to other devices, the ball height of the solder ball remains constant to avoid collapse.