The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Sep. 30, 2016
Applicant:
Chipmos Technologies Inc., Hsinchu, TW;
Inventor:
Kun-Shu Chuang, Hsinchu, TW;
Assignee:
ChipMOS Technologies Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 23/498 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/17 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/0236 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/1412 (2013.01);
Abstract
Provided is a semiconductor device including a substrate, a pad, a protective layer, a plurality of convex patterns, a redistribution layer (RDL), and a bump. The pad is disposed on the substrate. The protective layer is disposed on the substrate. The protective layer has a first opening exposing a portion of a surface of the pad. The convex patterns are disposed on the protective layer. The RDL is disposed on the convex patterns. The RDL extends from the pad to the convex patterns. The bump is disposed on the convex patterns.