The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Oct. 12, 2015
Applicant:

Chipmos Technologies Inc., Hsinchu, TW;

Inventor:

Shih-Hsi Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H01L 21/56 (2006.01); H01L 23/488 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); G06K 9/0002 (2013.01); G06K 9/00053 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/94 (2013.01); H01L 2924/18161 (2013.01);
Abstract

A fingerprint sensor chip package structure including a circuit carrier and a fingerprint sensor chip is provided. The fingerprint sensor chip is disposed on the circuit carrier. The fingerprint sensor chip includes a chip body and a plurality of sensing structures. The chip body has an active surface, a fingerprint sensing back surface, a plurality of bond pads disposed on the active surface and a plurality of through holes. The chip body is electrically connected to the circuit carrier with the active surface facing the circuit carrier. The sensing structures are disposed in the through holes respectively. Each of the sensing structures includes a first dielectric layer, a first metal layer, a second dielectric layer and a second metal layer. The first dielectric layer is exposed on the fingerprint sensing back surface. The second metal layer extends to the active surface to be electrically connected to the corresponding bond pad.


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