Tokyo, Japan

Tomohiro Uno

USPTO Granted Patents = 70 

 

Average Co-Inventor Count = 4.0

ph-index = 7

Forward Citations = 229(Granted Patents)


Inventors with similar research interests:


Location History:

  • Kawasaki, JP (1992 - 2001)
  • Futtsu, JP (2008 - 2013)
  • Tokyo, JP (2010 - 2023)

Company Filing History:


Years Active: 1992-2025

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70 patents (USPTO):Explore Patents

Title: **Tomohiro Uno: Innovator in Semiconductor Bonding Technologies**

Introduction

Tomohiro Uno, an accomplished inventor based in Tokyo, Japan, holds an impressive portfolio of 63 patents. His inventive work primarily focuses on advancements in bonding wires for semiconductor devices, showcasing his contributions to enhancing the reliability and efficiency of electronic components.

Latest Patents

Among his latest innovations, Uno has developed a bonding wire designed for semiconductor applications. This wire consists of a core material made of copper or a copper alloy, covered with a conductive metal coating that enhances its performance. The concentration profile of this bonding wire includes a significant average sum of palladium (Pd) and nickel (Ni) concentrations, optimized for functionality with required atomic percentages. Moreover, another inventive bonding wire produced by Uno features a core of aluminum or aluminum alloy, coated with silver or gold, ensuring high bonding reliability even under high-temperature conditions. This innovation emphasizes the alignment of crystal orientations, which is crucial for the wire's effective performance.

Career Highlights

Uno has made notable contributions while working with leading companies in the industry, including Nippon Micrometal Corporation and Nippon Steel Chemical & Material Co., Ltd. His inventive spirit and expertise have propelled advancements in the semiconductor sector, particularly in the development of high-performance bonding solutions.

Collaborations

Throughout his career, Uno has collaborated with esteemed colleagues such as Takashi Yamada and Daizo Oda. These partnerships have fostered creativity and innovation, driving forward their shared goals in semiconductor technology.

Conclusion

Tomohiro Uno’s significant contributions to bonding wire technology underscore his role as a key innovator in the semiconductor industry. With numerous patents to his name, his impact on improving electronic device reliability and efficiency continues to be felt in the field. As technology advances, Uno's work will likely remain influential in shaping the future of semiconductor applications.

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