This inventor holds 75 USPTO granted patents and 18 published patent applications and 28 EPO patents, primarily in Semiconductor Bonding Wire (CPC class H01L). Top assignees: Nippon Micrometal Corporation, Nippon Steel Chemical & Material Co., Ltd., Nippon Steel & Sumikin Materials Co., Ltd.. Active years: 1992-2026.
Inventors with similar research interests:
Location History:
- Kawasaki, JP (1992 - 2001)
- Futtsu, JP (2008 - 2013)
- Tokyo, JP (2010 - 2023)
Company Filing History:
55 out of 69 
29 out of 122 
19 out of 42 
Years Active: 1992-2026
Areas of Expertise:
Title: **Tomohiro Uno: Innovator in Semiconductor Bonding Technologies**
Introduction
Tomohiro Uno, an accomplished inventor based in Tokyo, Japan, holds an impressive portfolio of 63 patents. His inventive work primarily focuses on advancements in bonding wires for semiconductor devices, showcasing his contributions to enhancing the reliability and efficiency of electronic components.
Latest Patents
Among his latest innovations, Uno has developed a bonding wire designed for semiconductor applications. This wire consists of a core material made of copper or a copper alloy, covered with a conductive metal coating that enhances its performance. The concentration profile of this bonding wire includes a significant average sum of palladium (Pd) and nickel (Ni) concentrations, optimized for functionality with required atomic percentages. Moreover, another inventive bonding wire produced by Uno features a core of aluminum or aluminum alloy, coated with silver or gold, ensuring high bonding reliability even under high-temperature conditions. This innovation emphasizes the alignment of crystal orientations, which is crucial for the wire's effective performance.
Career Highlights
Uno has made notable contributions while working with leading companies in the industry, including Nippon Micrometal Corporation and Nippon Steel Chemical & Material Co., Ltd. His inventive spirit and expertise have propelled advancements in the semiconductor sector, particularly in the development of high-performance bonding solutions.
Collaborations
Throughout his career, Uno has collaborated with esteemed colleagues such as Takashi Yamada and Daizo Oda. These partnerships have fostered creativity and innovation, driving forward their shared goals in semiconductor technology.
Conclusion
Tomohiro Uno’s significant contributions to bonding wire technology underscore his role as a key innovator in the semiconductor industry. With numerous patents to his name, his impact on improving electronic device reliability and efficiency continues to be felt in the field. As technology advances, Uno's work will likely remain influential in shaping the future of semiconductor applications.