This inventor holds 78 USPTO granted patents and 6 published patent applications and 24 EPO patents, primarily in Bonding Wire Technology (CPC class H01L). Top assignees: Nippon Micrometal Corporation, Nippon Steel Chemical & Material Co., Ltd., Nippon Steel & Sumikin Materials Co., Ltd.. Active years: 1993-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Inventors with similar research interests:
Location History:
- Saitama-ken, JP (1997 - 2000)
- Tsurugashima, JP (1996 - 2006)
- Yamanashi-ken, JP (2006)
- Iruma, JP (2011 - 2016)
- Saitama, JP (1993 - 2024)
Company Filing History:
49 out of 69 
20 out of 122 
17 out of 42 
Years Active: 1993-2026
Areas of Expertise:
Title: Takashi Yamada: A Pioneering Inventor in Bonding Wire Technology
Introduction
Takashi Yamada is a renowned inventor based in Saitama, Japan, recognized for his significant contributions to the field of bonding wire technology. With a remarkable portfolio boasting 71 patents, he has paved the way for innovations that enhance the reliability of semiconductor devices.
Latest Patents
Among Takashi Yamada's latest patents are advancements in bonding wire. One patent describes a metal-coated aluminum bonding wire designed to ensure reliable bonding under high temperature conditions. This bonding wire features a core of aluminum or an aluminum alloy, coated with silver, gold, or an alloy comprising these metals. Notably, it specifies crystal orientations within the wire that optimize its performance.
Another of his patents involves an aluminum bonding wire, which similarly ensures high bonding reliability at elevated temperatures. This innovation is distinguished by its precise control over average crystal grain size and orientation, thereby improving reliability in semiconductor applications.
Career Highlights
Takashi Yamada has had an illustrious career, working with prestigious companies such as Nippon Micrometal Corporation and Nippon Steel & Sumikin Materials Co., Ltd. His work in these organizations has largely focused on developing innovative materials and processes for electronic applications, particularly in the semiconductor industry.
Collaborations
Throughout his career, Takashi has collaborated with notable colleagues, including Tomohiro Uno and Daizo Oda. These partnerships have fostered a creative exchange of ideas, leading to numerous advancements in bonding wire technologies.
Conclusion
With 71 patents to his name, Takashi Yamada's contributions to bonding wire technology significantly impact the semiconductor industry. His relentless pursuit of innovation continues to influence the reliability and efficiency of modern electronic devices, solidifying his reputation as a leading inventor in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile