Nippon Micrometal Corporation, headquartered in Saitama, Japan, specializes in the development and manufacturing of semiconductor bonding wire. The company focuses on advanced materials such as copper alloy, aluminum bonding wire, and silver bonding wire, catering to the needs of the semiconductor device industry. Additionally, Nippon Micrometal produces solder balls and power semiconductor components, positioning itself at the forefront of innovation in AI wiring materials and related technologies.

Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

69 Patents

#24 in Saitama 343-0827

#1,418 in Japan

#10,761 in the World

Saitama, Japan

Nippon Micrometal Corporation

Forward Citations = 131

38 inventors:

Tomohiro Uno (55 out of 75 patents)

Daizo Oda (52 out of 52 patents)

Takashi Yamada (49 out of 78 patents)

4. Teruo Haibara (28 out of 28 patents)

5. Tetsuya Oyamada (26 out of 26 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nippon Micrometal Corporation. Retrieved from https://idiyas.com/company/nippon-micrometal

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

29 patents (EPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]