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Nippon Micrometal Corporation

USPTO Granted Patents = 61

EPO Patents = 27

Forward Citations = 127

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38 inventors (with patents filed for the assignee):

Tomohiro Uno (50 out of 70 patents)

Takashi Yamada (45 out of 74 patents)

Daizo Oda (44 out of 44 patents)

4. Teruo Haibara (24 out of 24 patents)

5. Tetsuya Oyamada (21 out of 21 patents)

6. Ryo Oishi (19 out of 19 patents)

7. Motoki Eto (16 out of 16 patents)

8. Shinichi Terashima (10 out of 18 patents)

9. Keiichi Kimura (8 out of 20 patents)

10. Takayuki Kobayashi (6 out of 83 patents)

11. Kazuyuki Saito (6 out of 6 patents)

12. Akihito Nishibayashi (6 out of 6 patents)

13. Masamoto Tanaka (5 out of 13 patents)

14. Takumi Ohkabe (3 out of 3 patents)

15. Noritoshi Araki (3 out of 3 patents)

Core Competencies:

Copper Bonding Wire

AG Alloy Bonding Wire

Al Bonding Wire

AI Wiring Material

Cu Alloy Bonding Wire

Solder Ball

Junction Structure

Power Semiconductor Device

Electronic Member

Bonding Wire Manufacturing

Semiconductor Packaging

Copper Alloy Bonding Wire

61 patents: Sort by Forward Citations

1. 12463172 - AG alloy bonding wire for semiconductor devices and semiconductor device (2025-11-04),

2. 12463171 - Copper bonding wire for semiconductor devices and semiconductor device (2025-11-04),

3. 12412864 - Bonding wire for semiconductor devices (2025-09-09),

4. 12388044 - Al bonding wire (2025-08-12),

5. 12334467 - Copper bonding wire (2025-06-17),

6. 12325901 - AI wiring material (2025-06-10),

7. 12300658 - Copper alloy bonding wire for semiconductor devices (2025-05-13),

8. 12290883 - Bonding wire (2025-05-06),

9. 12166006 - Bonding wire for semiconductor devices (2024-12-10),

10. 12157189 - Junction structure, method for manufacturing junction structure, and solder ball (2024-12-03),

11. 12132025 - Bonding wire (2024-10-29),

12. 12090578 - Al bonding wire (2024-09-17),

13. 11929343 - Bonding wire for semiconductor devices (2024-03-12),

14. 11721660 - Bonding wire for semiconductor devices (2023-08-08),

15. 11612966 - Ag alloy bonding wire for semiconductor device (2023-03-28),

NIPPON MICROMETAL CORPORATION is a leading manufacturer of precision metal components based in Japan. With over 50 years of experience, we specialize in producing micro-formed and micro-welded components for various industries, including automotive, electronics, and medical. Our commitment to quality and innovation has earned us a reputation as a trusted partner among our customers worldwide. Visit our website to learn more about our capabilities and the solutions we offer.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

61 Patents

#27 in Saitama 343-0827

#1,484 in Japan

#11,618 in the World

Nippon Micrometal Corporation

Forward Citations = 127

38 inventors:

Tomohiro Uno (50 out of 70 patents)

Takashi Yamada (45 out of 74 patents)

Daizo Oda (44 out of 44 patents)

4. Teruo Haibara (24 out of 24 patents)

5. Tetsuya Oyamada (21 out of 21 patents)

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