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USPTO Data Jan 1 1976 - Nov 3 2026
70 Patents
#24 in Saitama 343-0827
#1,411 in Japan
#10,652 in the World
Nippon Micrometal Corporation
Forward Citations = 136
38 inventors:
Nippon Micrometal Corporation
Calculating rank
% Expired Patents = 5.7
EPO Patents = 29
Forward Citations = 136
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38 inventors (with patents filed for the assignee):
Tomohiro Uno (56 out of 76 patents)
Daizo Oda (53 out of 53 patents)
Takashi Yamada (49 out of 78 patents)
4. Teruo Haibara (28 out of 28 patents)
5. Tetsuya Oyamada (27 out of 27 patents)
6. Motoki Eto (24 out of 24 patents)
7. Ryo Oishi (23 out of 23 patents)
8. Shinichi Terashima (10 out of 18 patents)
9. Keiichi Kimura (8 out of 20 patents)
10. Takayuki Kobayashi (7 out of 85 patents)
11. Akihito Nishibayashi (7 out of 7 patents)
12. Kazuyuki Saito (6 out of 6 patents)
13. Masamoto Tanaka (5 out of 13 patents)
14. Noritoshi Araki (4 out of 4 patents)
15. Yuto Kurihara (4 out of 4 patents)
Core Competencies:
Bonding Wire
Semiconductor Devices
Copper Alloy
Aluminum Bonding Wire
Silver Bonding Wire
Solder Ball
Power Semiconductor
AI Wiring Material
Junction Structure
Thermal Management
70 patents:
Company Overview
Nippon Micrometal Corporation, headquartered in Saitama, Japan, specializes in the development and manufacturing of semiconductor bonding wire. The company focuses on advanced materials such as copper alloy, aluminum bonding wire, and silver bonding wire, catering to the needs of the semiconductor device industry. Additionally, Nippon Micrometal produces solder balls and power semiconductor components, positioning itself at the forefront of innovation in AI wiring materials and related technologies.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nippon Micrometal Corporation. Retrieved from https://idiyas.com/company/nippon-micrometal
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
29 patents (EPO):
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]