Saitama, Japan

Teruo Haibara

USPTO Granted Patents = 24 

 

Average Co-Inventor Count = 5.5

ph-index = 3

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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24 patents (USPTO):Explore Patents

Title: The Innovative Mind of Teruo Haibara

Introduction: Teruo Haibara, an accomplished inventor based in Saitama, Japan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 20 patents, he continues to push the boundaries of innovation in bonding wire technology, which plays a critical role in modern electronics.

Latest Patents: Among his latest inventions are two noteworthy patents focusing on bonding wires. The first, a metal-coated aluminum bonding wire, enhances bonding reliability in high-temperature conditions critical for semiconductor devices. This innovative wire comprises a core of aluminum or aluminum alloy, coated with silver or gold, with precise crystal orientations that contribute to its durability. The second patent details an aluminum bonding wire characterized by its average crystal grain size and specific crystal orientations that similarly increase bonding reliability during high-temperature operation.

Career Highlights: Throughout his career, Teruo Haibara has worked with notable companies, including Nippon Micrometal Corporation and Nippon Steel Chemical & Material Co., Ltd. His efforts in these organizations have broadened the scope of semiconductor materials and their applications, establishing him as a pivotal figure in the industry.

Collaborations: Haibara has collaborated with respected colleagues, including Takashi Yamada and Daizo Oda. Together, they have contributed to advancements in bonding wire technology, making significant strides that enhance semiconductor performance and reliability.

Conclusion: Teruo Haibara's innovative spirit and dedication to developing cutting-edge semiconductor technology are evident through his numerous patents. His work, characterized by a commitment to enhancing bonding wire reliability, positions him as a notable inventor in the electronics field, inspiring future innovations.

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