The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Mar. 16, 2022
Applicant:
Nippon Micrometal Corporation, Saitama, JP;
Inventors:
Daizo Oda, Saitama, JP;
Motoki Eto, Saitama, JP;
Takashi Yamada, Saitama, JP;
Teruo Haibara, Saitama, JP;
Ryo Oishi, Saitama, JP;
Assignee:
NIPPON MICROMETAL CORPORATION, Saitama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 24/43 (2013.01); H01L 24/48 (2013.01); H01L 2224/43125 (2013.01); H01L 2224/432 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/45105 (2013.01); H01L 2224/45109 (2013.01); H01L 2224/45117 (2013.01); H01L 2224/45123 (2013.01); H01L 2224/45138 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45163 (2013.01); H01L 2224/45605 (2013.01); H01L 2224/45609 (2013.01); H01L 2224/45623 (2013.01); H01L 2224/45639 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45655 (2013.01); H01L 2224/45663 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48151 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/20755 (2013.01); H01L 2924/20756 (2013.01); H01L 2924/20757 (2013.01); H01L 2924/20758 (2013.01);
Abstract
There is provided a novel Cu bonding wire that achieves a favorable FAB shape and achieve a favorable bond reliability of the 2nd bonding part even in a rigorous high-temperature environment. The bonding wire for semiconductor devices includes a core material of Cu or Cu alloy, and a coating layer having a total concentration of Pd and Ni of 90 atomic % or more formed on a surface of the core material. The bonding wire is characterized in that: