Saitama, Japan

Motoki Eto

This inventor holds 23 USPTO granted patents and 10 published patent applications and 5 EPO patents, primarily in Semiconductor Bonding. Top assignees: Nippon Micrometal Corporation, Nippon Steel Chemical & Material Co., Ltd., Nippon Steel Chemical & Material Co., Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Motoki Eto. Retrieved from https://idiyas.com/inventor/motoki-eto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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Areas of Expertise:
Bonding Wire
Semiconductor Devices
AI Bonding Wire
Copper Alloy
AG Alloy
Al Bonding Wire
Wiring Material
Alloy Materials
Thermal Conductivity
Electrical Conductivity
Manufacturing Techniques
23 patents (USPTO):Explore Patents

Title: Motoki Eto: A Pioneer in Semiconductor Bonding Wire Innovations

Introduction

Motoki Eto, a notable inventor based in Saitama, Japan, has made significant strides in the field of semiconductor technology. With a portfolio of 11 patents, he has contributed innovative solutions that enhance the reliability and performance of semiconductor devices.

Latest Patents

Eto's latest inventions include a sophisticated bonding wire designed for semiconductor devices. This bonding wire features a core material made from copper or a copper alloy, complemented by a coating layer that contains a conductive metal other than copper. Notably, the bonding wire showcases a detailed concentration profile where the combined average of palladium (Pd) and nickel (Ni) concentrations in the coating layer exceeds 50 atomic percent. The specifications further detail that the ratio of these elements falls between 0.2 and 20, with the coating thickness ranging from 20 nm to 180 nm. Additionally, the surface exhibits an acceptable gold (Au) concentration and a crystal grain size, contributing to its performance.

In another development, Eto has designed a metal-coated aluminum bonding wire that assures robust bonding reliability even under high-temperature conditions typical of semiconductor operations. This innovative wire utilizes a core of aluminum or an aluminum alloy, with a surface coating of silver, gold, or their alloys. It is distinguished by a crystal orientation favorable for effective performance, with a significant proportion of the <111> orientation in relation to the wire's longitudinal direction.

Career Highlights

Motoki Eto has earned his reputation through dedicated work at esteemed companies, including Nippon Micrometal Corporation and Nippon Steel Chemical & Material Co., Ltd. His contributions to these organizations have been critical in advancing technology related to semiconductor materials and applications.

Collaborations

Throughout his career, Eto has collaborated with notable colleagues, including Daizo Oda and Takashi Yamada. Their joint efforts have fostered an environment of innovation, leading to the successful development of multiple patents in the semiconductor sector.

Conclusion

Motoki Eto stands out as an influential inventor in the semiconductor industry, with his cutting-edge patents pushing the boundaries of technology. His work not only promises improved device performance but also exemplifies the importance of innovation in driving industry standards forward. The impact of his inventions will resonate in semiconductor applications for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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