logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12781313 B1

PDFFull Text
Date of Patent:
Nov. 03, 2026

Filed:

Jan. 31, 2022

Ai wiring material

Applicants:

Nippon Micrometal Corporation, Saitama, JP;

Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;

Inventors:

Tomohiro Uno, Tokyo, JP;

Yuya Suto, Tokyo, JP;

Tetsuya Oyamada, Tokyo, JP;

Daizo Oda, Saitama, JP;

Yuto Kurihara, Saitama, JP;

Motoki Eto, Saitama, JP;

Assignees:

NIPPON MICROMETAL CORPORATION, Saitama, JP;

NIPPON STEEL Chemical & Material Co., Ltd., Tokyo, JP;

Attorney:

Rimon P.C.

Primary Examiner:

Keith D Hendricks

Assistant Examiner:

Janell C Morillo

Int. Cl.
CPC ...
C22C 21/00 (2006.01); C22C 1/02 (2006.01); C22C 21/02 (2006.01); C22C 21/08 (2006.01); C22C 21/14 (2006.01); C22C 21/16 (2006.01); C22F 1/043 (2006.01); C22F 1/047 (2006.01); C22F 1/057 (2006.01); H10W 72/50 (2026.01);
U.S. Cl.
CPC ...
C22C 21/14 (2013.01); C22C 1/026 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22C 21/08 (2013.01); C22C 21/16 (2013.01); C22F 1/043 (2013.01); C22F 1/047 (2013.01); C22F 1/057 (2013.01); H10W 72/5524 (2026.01);
Abstract

There is provided an Al wiring material which can achieve sufficient bond reliability of bonded parts in a high-temperature environment at the time when a semiconductor device operates. The Al wiring material containing one or more of Pd and Pt so as to satisfy3≤1≤90 or 10≤1≤250, and3≤(11)≤300,

Find Patent Forward Citations

Quick Actions:

Uno, Tomohiro. (2026). Ai wiring material (U.S. Patent No. 12781313). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12781313

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…