The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Jun. 27, 2023
Applicant:
Nippon Micrometal Corporation, Saitama, JP;
Inventors:
Assignee:
NIPPON MICROMETAL CORPORATION, Saitama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2005.12); B23K 20/00 (2005.12); B23K 35/30 (2005.12); B23K 101/40 (2005.12);
U.S. Cl.
CPC ...
B23K 35/0261 (2012.12); B23K 35/302 (2012.12); B23K 20/004 (2012.12); B23K 2101/40 (2018.07);
Abstract
There is provided a novel alloy-coated Cu bonding wire that achieves a favorable FAB shape and also a favorable initial bondability of a 2nd bonding part including adhesion of the 2nd bonding part, and that reduces a galvanic corrosion in a high-temperature environment to achieve a favorable bond reliability of the 2nd bonding part. The alloy-coated Cu bonding wire includes a core material of Cu or Cu alloy, and a coating layer having a total concentration of Pd and Ni of 90 atomic % or more formed on a surface of the core material. The bonding wire is characterized in that: