Saitama, Japan

Ryo Oishi

USPTO Granted Patents = 19 

 

Average Co-Inventor Count = 5.2

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Iruma, JP (2014)
  • Saitama, JP (2017 - 2024)

Company Filing History:


Years Active: 2014-2025

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19 patents (USPTO):Explore Patents

Title: Innovations by Inventor Ryo Oishi: A Focus on Semiconductor Bonding Wires

Introduction: Ryo Oishi, an accomplished inventor based in Saitama, Japan, has made significant contributions to the field of semiconductor technologies, holding a total of 15 patents. His innovative work primarily centers around bonding wires, which are crucial components in semiconductor devices.

Latest Patents: Among Ryo Oishi's latest patents is an advanced bonding wire for semiconductor devices. This novel Cu bonding wire enhances the favorable FAB shape and provides substantial bond reliability of the second bonding part, even under rigorous high-temperature conditions. The bonding wire features a core material made of Cu or Cu alloy, along with a coating layer that has a total concentration of palladium (Pd) and nickel (Ni) of 90 atomic percent or more, formed on the surface of the core material. Additionally, another notable patent addresses the reduction of galvanic corrosion in high-temperature environments, further ensuring the bond reliability of the second bonding part.

Career Highlights: Oishi’s career is marked by his association with reputable companies, including Nippon Micrometal Corporation and Nippon Steel & Sumikin Materials Co., Ltd. His expertise and innovative spirit have significantly advanced the semiconductor industry.

Collaborations: Throughout his journey, Ryo Oishi has collaborated with notable colleagues, such as Takashi Yamada and Daizo Oda. These partnerships have played a key role in the development and refinement of his patents.

Conclusion: Ryo Oishi's innovative contributions to semiconductor technologies, particularly in bonding wires, underscore his status as a prominent inventor in the field. With a proven track record of patents and collaborations with esteemed professionals, Oishi continues to influence the advancement of semiconductor device reliability and efficiency.

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