The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Jul. 22, 2015
Nippon Micrometal Corporation, Saitama, JP;
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Takashi Yamada, Saitama, JP;
Daizo Oda, Saitama, JP;
Teruo Haibara, Saitama, JP;
Ryo Oishi, Saitama, JP;
Kazuyuki Saito, Saitama, JP;
Tomohiro Uno, Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Abstract
A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 μm or more and 1.3 μm or less.