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Nippon Steel & Sumikin Materials Co., Ltd.

USPTO Granted Patents = 42

EPO Patents = 15

Trademarks = 1

Forward Citations = 157

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77 inventors (with patents filed for the assignee):

Tomohiro Uno (19 out of 70 patents)

Takashi Yamada (17 out of 74 patents)

Daizo Oda (11 out of 44 patents)

4. Teruo Haibara (8 out of 24 patents)

5. Ryo Oishi (8 out of 19 patents)

6. Shinichi Terashima (7 out of 18 patents)

7. Masamoto Tanaka (6 out of 13 patents)

8. Shuji Nagasaki (5 out of 11 patents)

9. Yuji Kubo (5 out of 23 patents)

10. Jun Nakatsuka (4 out of 6 patents)

11. Motoki Eto (3 out of 16 patents)

12. Takayuki Kobayashi (3 out of 83 patents)

13. Akira Kobayashi (3 out of 37 patents)

14. Keiichi Kimura (3 out of 20 patents)

15. Kazuyuki Saito (3 out of 6 patents)

Core Competencies:

Austenitic Stainless Steel

Spherical Crystalline Silica

Cu Alloy Bonding Wire

Honeycomb Core

Steel Foil Manufacturing

Fiber-Reinforced Plastic

Metal Substrate

Resin-Metal Composite

Carbon Plate

Insulating Film-Coated Foil

Lead-Free Solder Bump

Gold Wire Connection

42 patents: Sort by Forward Citations

1. 10323294 - Austenitic stainless steel foil (2019-06-18),

2. 10253219 - Spherical crystalline silica particles and method for producing same (2019-04-09),

3. 10236272 - Cu alloy core bonding wire with Pd coating for semiconductor device (2019-03-19),

4. 10232362 - Honeycomb core for carrying catalyst and catalytic converter (2019-03-19),

5. 10205135 - Steel foil for power storage device container, power storage device container, power storage device, and manufacturing method of steel foil for power storage device container (2019-02-12),

6. 10201953 - Steel foil and method for manufacturing the same (2019-02-12),

7. 10144184 - Flat fiber-reinforced plastic strand, flat fiber-reinforced plastic strand sheet, and method of manufacturing the same (2018-12-04),

8. 10137534 - Bonding wire for semiconductor device (2018-11-27),

9. 10121764 - Method for forming ball in bonding wire (2018-11-06),

10. 10121758 - Bonding wire for semiconductor device (2018-11-06),

11. 10072549 - Metal substrate for catalytic converters (2018-09-11),

12. 10032741 - Bonding wire for semiconductor device (2018-07-24),

13. 9997786 - Steel foil and method for manufacturing the same (2018-06-12),

14. 9905817 - Resin-metal composite seal container and method for producing same (2018-02-27),

15. 9902134 - Metal foil for base material and producing method thereof (2018-02-27),

NIPPON STEEL & SUMIKIN MATERIALS CO., LTD. is one of the leading global steel manufacturing companies. With a rich history of over a century, they specialize in producing high-quality steel products for various industries worldwide. Their extensive range of steel products includes plates, sheets, bars, pipes, and tubes. NIPPON STEEL & SUMIKIN MATERIALS CO., LTD. is committed to sustainable practices, innovation, and customer satisfaction.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

42 Patents

#777 in Tokyo

#1,868 in Japan

#15,867 in the World

Nippon Steel & Sumikin Materials Co., Ltd.

Forward Citations = 157

77 inventors:

Tomohiro Uno (19 out of 70 patents)

Takashi Yamada (17 out of 74 patents)

Daizo Oda (11 out of 44 patents)

4. Teruo Haibara (8 out of 24 patents)

5. Ryo Oishi (8 out of 19 patents)

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