The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Apr. 14, 2016
Nippon Micrometal Corporation, Saitama, JP;
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Noritoshi Araki, Saitama, JP;
Takashi Yamada, Saitama, JP;
Teruo Haibara, Saitama, JP;
Ryo Oishi, Saitama, JP;
Tomohiro Uno, Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Abstract
The present invention provides a ball forming method for forming a ball portion at a tip of a bonding wire which includes a core material mainly composed of Cu, and a coating layer mainly composed of Pd and formed over a surface of the core material, wherein the ball portion is formed in non-oxidizing atmosphere gas including hydrocarbon which is gas at room temperature and atmospheric pressure, the method being capable of improving Pd coverage on a ball surface in forming a ball at a tip of the Pd-coated Cu bonding wire.