The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Mar. 29, 2021
Nippon Micrometal Corporation, Saitama, JP;
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Daizo Oda, Saitama, JP;
Takumi Ookabe, Saitama, JP;
Motoki Eto, Saitama, JP;
Noritoshi Araki, Saitama, JP;
Ryo Oishi, Saitama, JP;
Teruo Haibara, Saitama, JP;
Tomohiro Uno, Tokyo, JP;
Tetsuya Oyamada, Tokyo, JP;
NIPPON MICROMETAL CORPORATION, Saitama, JP;
NIPPON STEEL Chemical & Material Co., Ltd., Tokyo, JP;
Abstract
There is provided an Ag alloy bonding wire for semiconductor devices which exhibits a favorable bond reliability in a high-temperature environment even when using a mold resin of high S content and can suppress a chip damage at the time of ball bonding. The Ag alloy bonding wire is characterized by containing at least one element selected from the group consisting of Pd and Pt (hereinafter referred to as a 'first element') and at least one element selected from the group consisting of P, Cr, Zr and Mo (hereinafter referred to as a “second element”) so as to satisfy0.05≤x1≤3.0, and15≤x2≤700