Company Filing History:
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1 out of 122 Years Active: 2025
Title: Takumi Ookabe: Innovator in Semiconductor Technology
Introduction
Takumi Ookabe is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to bonding wires.
Latest Patents
Takumi Ookabe holds a patent for an Ag alloy bonding wire designed for semiconductor devices. This invention exhibits favorable bond reliability in high-temperature environments, even when using mold resins with high sulfur content. It effectively suppresses chip damage during the ball bonding process. The Ag alloy bonding wire is characterized by containing at least one element selected from palladium (Pd) and platinum (Pt), as well as at least one element from phosphorus (P), chromium (Cr), zirconium (Zr), and molybdenum (Mo). The specific composition is designed to meet the criteria of 0.05 ≤ x1 ≤ 3.0 and 15 ≤ x2 ≤ 700.
Career Highlights
Throughout his career, Takumi Ookabe has worked with prominent companies in the semiconductor industry. He has been associated with Nippon Micrometal Corporation and Nippon Steel Chemical & Material Co., Ltd. His work has significantly impacted the development of reliable semiconductor devices.
Collaborations
Takumi Ookabe has collaborated with notable colleagues, including Daizo Oda and Motoki Eto. Their combined expertise has contributed to advancements in semiconductor technology.
Conclusion
Takumi Ookabe's innovative work in semiconductor bonding wires showcases his dedication to enhancing technology in this critical field. His contributions continue to influence the industry positively.