The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Mar. 12, 2020
Nippon Micrometal Corporation, Saitama, JP;
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Takashi Yamada, Saitama, JP;
Akihito Nishibayashi, Saitama, JP;
Teruo Haibara, Saitama, JP;
Daizo Oda, Saitama, JP;
Motoki Eto, Saitama, JP;
Tetsuya Oyamada, Tokyo, JP;
Takayuki Kobayashi, Tokyo, JP;
Tomohiro Uno, Tokyo, JP;
NIPPON MICROMETAL CORPORATION, Saitama, JP;
NIPPON STEEL Chemical & Material Co., Ltd., Tokyo, JP;
Abstract
There is provided a metal-coated Al bonding wire which can provide a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the metal-coated Al bonding wire is operated. The bonding wire includes a core wire of Al or Al alloy, and a coating layer of Ag, Au or an alloy containing them formed on the outer periphery of the core wire, and the bonding wire is characterized in that when measuring crystal orientations on a cross-section of the core wire in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <111> angled at 15 degrees or less to a wire longitudinal direction has a proportion of 30 to 90% among crystal orientations in the wire longitudinal direction. Preferably, the surface roughness of the wire is 2 μm or less in terms of Rz.