The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Oct. 18, 2022
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Tomohiro Uno, Tokyo, JP;
Tetsuya Oyamada, Tokyo, JP;
Daizo Oda, Saitama, JP;
Motoki Eto, Saitama, JP;
NIPPON STEEL Chemical & Material Co., Ltd., Tokyo, JP;
NIPPON MICROMETAL CORPORATION, Saitama, JP;
Abstract
A bonding wire includes a core material of Cu or Cu alloy, and a coating layer containing a conductive metal other than Cu on a surface of the core material. In a concentration profile in a depth direction of the wire obtained, an average value of sum of a Pd concentration C(atomic %) and an Ni concentration C(atomic %) for measurement points in the coating layer is 50 atomic % or more, an average value of a ratio of Cto Cfor measurement points in the coating layer is from 0.2 to 20 and a thickness of the coating layer is from 20 nm to 180 nm. An Au concentration Cat a surface of the wire is from 10 atomic % to 85 atomic %. An average size of crystal grains in a circumferential direction of the wire is from 35 nm to 200 nm.