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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11101234 B1

PDFFull Text
Date of Patent:
Aug. 24, 2021

Filed:

Aug. 28, 2015

Cu pillar cylindrical preform for semiconductor connection

Applicants:

Nippon Micrometal Corporation, Saitama, JP;

Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;

Inventors:

Takashi Yamada, Saitama, JP;

Daizo Oda, Saitama, JP;

Teruo Haibara, Saitama, JP;

Shinichi Terashima, Tokyo, JP;

Assignees:

NIPPON MICROMETAL CORPORATION, Saitama, JP;

NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

David Sample

Assistant Examiner:

Elizabeth Collister

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/50 (2006.01); C22C 9/00 (2006.01); H01L 23/12 (2006.01); B23K 1/008 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); B23K 101/38 (2006.01); B23K 103/12 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); C22C 9/00 (2013.01); H01L 23/12 (2013.01); H01L 23/50 (2013.01); H01L 24/11 (2013.01); B23K 2101/38 (2018.08); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); H01L 2224/1111 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13639 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01017 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01);
Abstract

A material for Cu pillars is formed as cylindrical preforms in advance and connecting these cylindrical preforms to electrodes on a semiconductor chip to form Cu pillars. Due to this, it becomes possible to make the height/diameter ratio of the Cu pillars 2.0 or more. Since electroplating is not used, the time required for production of the Cu pillars is short and the productivity can be improved. Further, the height of the Cu pillars can be raised to 200 μm or more, so these are also preferable for moldunderfill. The components can be freely adjusted, so it is possible to easily design the alloy components to obtain highly reliable Cu pillars.

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