The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Dec. 16, 2021
Nippon Micrometal Corporation, Iruma, JP;
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Daizo Oda, Saitama, JP;
Takumi Ohkabe, Saitama, JP;
Teruo Haibara, Saitama, JP;
Takashi Yamada, Saitama, JP;
Tetsuya Oyamada, Tokyo, JP;
Tomohiro Uno, Tokyo, JP;
NIPPON MICROMETAL CORPORATION, Iruma, JP;
NIPPON STEEL Chemical & Material Co., Ltd., Tokyo, JP;
Abstract
Bonding wire for semiconductor devices contains one or more of Be, B, P, Ca, Y, La, and Ce in a total of 0.031 at % to obtain a 0.180 at %, further contains one or more of In, Ga, and Cd in a total of 0.05 at % to 5.00 at %, and has a balance of Ag and unavoidable impurities. Due to this, it is possible to obtain a bonding wire for semiconductor devices sufficiently forming an intermetallic compound layer at a ball bond interface to secure the bond strength of the ball bond, not causing neck damage even in a low loop, having a good leaning characteristic, and having a good FAB shape.