The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Sep. 24, 2021
Nippon Micrometal Corporation, Saitama, JP;
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Noritoshi Araki, Saitama, JP;
Takumi Ookabe, Saitama, JP;
Daizo Oda, Saitama, JP;
Tomohiro Uno, Tokyo, JP;
Tetsuya Oyamada, Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
NIPPON STEEL Chemical & Material Co., Ltd., Tokyo, JP;
Abstract
There is provided a novel Ag alloy bonding wire for semiconductor devices which provides an excellent bonded ball shape during ball bonding, which is required for high-density packaging. The Ag alloy bonding wire for semiconductor devices is made of an Ag alloy that contains one or more elements selected from the group consisting of Te, Bi and Sb and that satisfies at least one of the following conditions (1) to (3):