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Nippon Steel Materials Co., Ltd.

USPTO Granted Patents = 19

CIPO Patents = 1

EPO Patents = 1

Trademarks = 1

Forward Citations = 74

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34 inventors (with patents filed for the assignee):

Tomohiro Uno (9 out of 70 patents)

Takashi Yamada (7 out of 74 patents)

Keiichi Kimura (7 out of 20 patents)

4. Shinichi Terashima (3 out of 18 patents)

5. Kohei Tatsumi (3 out of 27 patents)

6. Noriko Yamada (2 out of 16 patents)

7. Yuji Kubo (2 out of 23 patents)

8. Toyoshi Ogura (2 out of 4 patents)

9. Hiroaki Sakamoto (2 out of 34 patents)

10. Akihito Nishibayashi (2 out of 6 patents)

11. Kensuke Okazawa (2 out of 5 patents)

12. Shinji Tokumaru (2 out of 8 patents)

13. Nobuaki Ito (2 out of 4 patents)

14. Eiji Hashino (2 out of 13 patents)

15. Masaki Okajima (2 out of 17 patents)

19 patents: Sort by Forward Citations

1. 9028625 - High Al-content steel sheet excellent in workability and method of production of same (2015-05-12),

2. 8961713 - Stainless steel foil for flexible display use (2015-02-24),

3. 8389860 - Bonding wire for semiconductor devices (2013-03-05),

4. 8299356 - Bonding wire for semiconductor devices (2012-10-30),

5. 8247911 - Wire bonding structure and method for forming same (2012-08-21),

6. 8104663 - Solder ball mounting method and apparatus (2012-01-31),

7. 8102061 - Semiconductor device bonding wire and wire bonding method (2012-01-24),

8. 8097960 - Semiconductor mounting bonding wire (2012-01-17),

9. 8096858 - Polishing pad conditioner (2012-01-17),

10. 8038973 - High purity silicon production system and production method (2011-10-18),

11. 8004094 - Copper alloy bonding wire for semiconductor device (2011-08-23),

12. 7952028 - Bonding wire for semiconductor device (2011-05-31),

13. 7951458 - Coating solution for forming flat-surface insulating film, flat-surface insulating film-coated substrate, and production method of a flat-surface insulating film-coated substrate (2011-05-31),

14. 7830008 - Gold wire for connecting semiconductor chip (2010-11-09),

15. 7820913 - Bonding wire for semiconductor device (2010-10-26),

Nippon Steel Materials Co., Ltd. is a leading global manufacturer and supplier of steel materials. With a rich history spanning over a century, the company specializes in producing high-quality steel products for various industries such as automotive, construction, machinery, and energy. Nippon Steel Materials is committed to continuous innovation, research, and development to meet the ever-evolving needs of its customers. Their extensive product portfolio includes flat steel, long steel, pipes and tubes, and specialty steel. Through their advanced manufacturing processes, superior quality control, and sustainable practices, Nippon Steel Materials aims to contribute to the development of a sustainable society.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

19 Patents

#1,197 in Tokyo

#2,972 in Japan

#31,731 in the World

Nippon Steel Materials Co., Ltd.

Forward Citations = 74

34 inventors:

Tomohiro Uno (9 out of 70 patents)

Takashi Yamada (7 out of 74 patents)

Keiichi Kimura (7 out of 20 patents)

4. Shinichi Terashima (3 out of 18 patents)

5. Kohei Tatsumi (3 out of 27 patents)

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