Chiba, Japan

Eiji Hashino

USPTO Granted Patents = 13 

 

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 70(Granted Patents)


Location History:

  • Kawasaki, JP (1998 - 2006)
  • Chiba, JP (2003 - 2007)
  • Futtsu, JP (2008)
  • Tokyo, JP (2012 - 2014)

Company Filing History:


Years Active: 1998-2014

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13 patents (USPTO):Explore Patents

Title: Eiji Hashino: A Pioneer in Lead-Free Solder Innovations

Introduction

Eiji Hashino, an inventive mind based in Chiba, Japan, has made significant contributions to the field of electronics through his innovative solutions in soldering technologies. With a remarkable portfolio of 13 patents, Hashino stands out as a leader in developing environmentally friendly materials for electronic assembly.

Latest Patents

One of Hashino's latest patents is the "Lead-free solder bump bonding structure." This innovation enhances the bonding interface at the lead-free solder bump by creating scallop-shaped intermetallic compound layers, effectively mitigating copper diffusion and minimizing electromigration. This advancement allows for the omission of a nickel barrier layer previously required on copper electrode surfaces, reducing manufacturing burdens and improving efficiency.

Another notable patent is the "Solder ball mounting method and apparatus." This invention outlines a sophisticated way of aligning solder balls with electrode holes in a mask, utilizing vibration to facilitate the dropping of the solder ball into place. The design ensures excess solder can be recovered, further streamlining the manufacturing process.

Career Highlights

Hashino's career includes key roles at Nippon Steel Corporation and Nippon Steel Materials Co., Ltd., where he focused on developing advanced manufacturing techniques for electronic components. His dedication to innovation has significantly influenced the industry, especially in lead-free solder technology.

Collaborations

Throughout his career, Hashino has collaborated with esteemed colleagues, including Kenji Shimokawa and Kohei Tatsumi. These partnerships have enriched his inventive projects, fostering a collaborative spirit that has led to groundbreaking advancements in solder technologies.

Conclusion

Eiji Hashino's pioneering work in lead-free solder technologies underscores his commitment to advancing electronic manufacturing. His innovations not only enhance efficiency but also contribute to environmentally sustainable practices in the electronics industry, reaffirming his status as a significant inventor in this field.

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