The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2006
Filed:
Aug. 04, 2000
Kohei Tatsumi, Kawasaki, JP;
Kenji Shimokawa, Kawasaki, JP;
Eiji Hashino, Kawasaki, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
A semiconductor device () comprising electrodes formed on a semiconductor chip () and bumps () which consist of a low melting point metal ball spherically formed and having a given size and which are adhesive bonded to the electrodes (). The electrodes () are formed from an electrode material of Cu or a Cu alloy, Al or an Al alloy, or Au or a Au alloy. When the electrode material is composed of Al or an Al alloy, the electrodes contain, on the electrode material layer of Al or an Al alloy, at least one layer () composed of a metal or metal alloy (preferably a metal selected form Ti, W, Ni, Cr, Au, Pd, Cu, Pt, Ag, Sn or Pb, or an alloy of these metals) having a melting point higher than the electrode material. The low melting point metal balls () are adhesive bonded to the electrodes () preferably with a flux. The low melting point metal balls () adhesive bonded to the respective electrodes () may also be reflowed to form semispherical bumps () before use.