The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2008
Filed:
Mar. 20, 2006
Toshiya Kinoshita, Tokyo-To, JP;
Eiji Hashino, Futtsu, JP;
Setsuo Sato, Futtsu, JP;
Ryuichi Araki, Futtsu, JP;
Toshiya Kinoshita, Tokyo-To, JP;
Eiji Hashino, Futtsu, JP;
Setsuo Sato, Futtsu, JP;
Ryuichi Araki, Futtsu, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on a surface of the support member, wherein the plurality of hard abrasive grains are regularly arranged on the surface of the support member. The CMP conditioner according to the second aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on the surface of the support member, wherein the plurality of hard abrasive grains are arranged on the surface of the support member regularly and so as for the density of the hard abrasive grains to decrease from the inner side of the support member toward the outer side of the support member.