Tokyo-to, Japan

Toshiya Kinoshita


Average Co-Inventor Count = 1.8

ph-index = 5

Forward Citations = 87(Granted Patents)


Location History:

  • Kawasaki, JP (1995 - 2004)
  • Tokyo-To, JP (2008)

Company Filing History:


Years Active: 1995-2008

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5 patents (USPTO):Explore Patents

Title: Toshiya Kinoshita: Innovator in CMP Conditioner Technology

Introduction

Toshiya Kinoshita is a prominent inventor based in Tokyo-to, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of chemical mechanical polishing (CMP) conditioners. With a total of five patents to his name, Kinoshita's work has been instrumental in enhancing the performance and reliability of semiconductor substrates.

Latest Patents

Kinoshita's latest patents include innovative designs for CMP conditioners. One of his notable inventions is a CMP conditioner that suppresses microscratching on semiconductor substrates while ensuring stable properties. This invention features a support member with a carefully arranged array of hard abrasive grains on its surface. Another patent focuses on a pad conditioner for semiconductor substrates, which utilizes a joining alloy layer to embed hard abrasive grains, enhancing the conditioning process through effective slide contact with polishing pads.

Career Highlights

Kinoshita is affiliated with Nippon Steel Corporation, where he has been able to apply his expertise in materials science and engineering. His work has not only advanced the technology used in semiconductor manufacturing but has also contributed to the overall efficiency of the production process.

Collaborations

Throughout his career, Kinoshita has collaborated with notable colleagues, including Motonori Tamura and Eiji Hashino. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Toshiya Kinoshita's contributions to CMP conditioner technology have made a significant impact on the semiconductor industry. His innovative patents and collaborative efforts continue to drive advancements in this critical field.

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