The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Aug. 27, 1997
Applicants:
Kohei Tatsumi, Kawasaki, JP;
Kenji Shimokawa, Kawasaki, JP;
Eiji Hashino, Kawasaki, JP;
Inventors:
Assignee:
Nippon Steel Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H05K003/34 ;
U.S. Cl.
CPC ...
Abstract
The object of the present invention is to provide a free and precise control of the plating amount while easily determining a selected portion to be plated. Small ballsare arranged at, and adhered or bonded to, via holesof a TAB tapeand the small ballsare then melted so that a copper wiringexposed at the via holesof the TAB tapecan be selectively plated with a different metal to enable selected portions of a substrate for electronic devices to be partially plated easily and precisely.