The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2005
Filed:
Sep. 27, 2002
Kohei Tatsumi, Chiba, JP;
Kenji Shimokawa, Chiba, JP;
Eiji Hashino, Chiba, JP;
Nobuo Takeda, Chiba, JP;
Atsuyuki Fukano, Chiba, JP;
Kohei Tatsumi, Chiba, JP;
Kenji Shimokawa, Chiba, JP;
Eiji Hashino, Chiba, JP;
Nobuo Takeda, Chiba, JP;
Atsuyuki Fukano, Chiba, JP;
Nippon Steel Corporation, Tokyo, JP;
Ball Semiconductor Corporation, Chiba, JP;
Abstract
A spherical semiconductor device includes a spherical semiconductor element having one or more electrodes on its surface. Spherical conductive bumps are formed at the positions of the electrodes. The electrodes are so arranged as to contact a common plane. Spherical bumps constituting a group to be connected to the outside protrude above the spherical semiconductor element such that a predetermined gap is formed between a plane or a spherical surface capable of contacting the spherical bumps and the surface of the spherical semiconductor element. The spherical semiconductor device is connected to various circuit boards or another semiconductor device through the spherical bumps. This affords easy and accurate electrical connections to the outside.