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For the Inventor, By the Inventor

Chiba, Japan

Atsuyuki Fukano

This inventor holds 5 USPTO granted patents. Top assignees: Ball Semiconductor Corporation, Nippon Steel Corporation, Other. Active years: 1999-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Atsuyuki Fukano. Retrieved from https://idiyas.com/inventor/atsuyuki-fukano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5

% Patents Active = 80.0

Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 45(Granted Patents)


Location History:

  • Tokyo, JP (1999 - 2001)
  • Addison, TX (US) (2002)
  • Chiba, JP (2003 - 2005)

Company Filing History:

goldMedal4 out of 93 
 
Ball Semiconductor Corporation
 patents
silverMedal1 out of 3,721 
 
Nippon Steel Corporation
 patents
bronzeMedal1 out of 834,570 
Other
 patents
where one patent can have more than one assignee

Years Active: 1999-2005

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5 patents (USPTO):Explore Patents
1. 6909182 - Spherical semiconductor device and method for fabricating the same (2005-06-21),
2. 6509645 - Spherical semiconductor device and method for fabricating the same (2003-01-21),
3. 6453458 - System and method for generating a flat mask design for projecting a circuit pattern to a spherical semiconductor device (2002-09-17),
4. 6178131 - Magnetic random access memory (2001-01-23),
5. 5986348 - Magnetic alignment system for bumps on an integrated circuit device (1999-11-16),

Title: Innovations of Atsuyuki Fukano

Introduction

Atsuyuki Fukano is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor devices.

Latest Patents

One of his latest patents is for a spherical semiconductor device and method for fabricating the same. This invention features a spherical semiconductor element equipped with one or more electrodes on its surface. Spherical conductive bumps are strategically formed at the positions of these electrodes. The arrangement of the electrodes allows them to contact a common plane. The spherical bumps, which are designed to connect to external circuits, protrude above the spherical semiconductor element, creating a predetermined gap. This design facilitates easy and accurate electrical connections to various circuit boards or other semiconductor devices.

Career Highlights

Throughout his career, Atsuyuki Fukano has worked with several companies, including Ball Semiconductor Corporation. His experience in the semiconductor industry has allowed him to develop cutting-edge technologies that push the boundaries of current capabilities.

Collaborations

Atsuyuki has collaborated with notable professionals in his field, including Kohei Tatsumi and Kenji Shimokawa. These partnerships have contributed to the advancement of his innovative projects and patents.

Conclusion

Atsuyuki Fukano's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the industry. His innovative designs continue to influence the development of advanced semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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