The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Mar. 15, 1999
Applicant:
Inventor:
Atsuyuki Fukano, Tokyo, JP;
Assignee:
Ball Semiconductor Inc., Allen, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257780 ; 257781 ;
Abstract
A unique integrated circuit device and method for using same is disclosed. The integrated circuit includes a plurality of bonding pads. Coupled to each bonding pads is a ferromagnetic material and an external connector, such as a solder bump. The ferromagnetic material is isolated to an area associated with each bonding pad. When the ferromagnetic material is magnetized, it is capable of aligning the solder bump to a connection point of another device, as long as the connection point is magnetically attracted. The other device may be a second integrated circuit device or a circuit board. As a result, the bonding pad aligns with and connects to the connection point.