The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Jun. 26, 2008
Applicants:
Shinichi Terashima, Tokyo, JP;
Tomohiro Uno, Tokyo, JP;
Kohei Tatsumi, Tokyo, JP;
Takashi Yamada, Saitama, JP;
Atsuo Ikeda, Saitama, JP;
Daizo Oda, Saitama, JP;
Inventors:
Shinichi Terashima, Tokyo, JP;
Tomohiro Uno, Tokyo, JP;
Kohei Tatsumi, Tokyo, JP;
Takashi Yamada, Saitama, JP;
Atsuo Ikeda, Saitama, JP;
Daizo Oda, Saitama, JP;
Assignees:
Nippon Steel Materials Co., Ltd, Tokyo, JP;
Nippon Micrometal Corporation, Iruma, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provided a bonding wire which does not cause a leaning failure or the like. A semiconductor mounting bonding wire has a breaking elongation of 7 to 20%, and stress at 1% elongation is greater than or equal to 90% of a tensile strength and is less than or equal to 100% thereof.