Iruma, Japan

Atsuo Ikeda


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 93(Granted Patents)


Location History:

  • Saitama, JP (2012)
  • Iruma, JP (2014 - 2016)

Company Filing History:


Years Active: 2012-2016

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4 patents (USPTO):Explore Patents

Title: Atsuo Ikeda: Innovator in Bonding Structures

Introduction

Atsuo Ikeda is a notable inventor based in Iruma, Japan, recognized for his contributions to the field of semiconductor technology. He holds a total of four patents, showcasing his innovative approach to bonding structures in electronic devices. His work emphasizes enhancing reliability and productivity in semiconductor manufacturing.

Latest Patents

One of Ikeda's latest patents is focused on a bonding structure of a bonding wire. This invention aims to provide a copper-based bonding wire that achieves low material costs and high productivity in continuous bonding processes. It also ensures excellent reliability during high-temperature heating and various testing conditions. The bonding structure connects the bonding wire to a ball bump on a semiconductor device's electrode, with both components primarily made of copper. The design includes a concentrated layer at the bonding interface, significantly increasing the concentration of a metal other than copper.

Another significant patent by Ikeda involves a bonding structure of multilayer copper bonding wire. This innovation features a ball-bonded portion created by bonding a ball portion on the end of a multilayer copper bonding wire. The wire consists of a core made mainly of copper, surrounded by an outer layer of noble metals such as palladium, gold, silver, or platinum. This design enhances the bonding quality and reliability of semiconductor devices.

Career Highlights

Ikeda has worked with prominent companies in the industry, including Nippon Steel & Sumikin Materials Co., Ltd. and Nippon Micrometal Corporation. His experience in these organizations has contributed to his expertise in semiconductor materials and bonding technologies.

Collaborations

Throughout his career, Ikeda has collaborated with talented individuals such as Tomohiro Uno and Takashi Yamada. These partnerships have fostered innovation and advancements in the field of semiconductor technology.

Conclusion

Atsuo Ikeda's work in bonding structures has significantly impacted the semiconductor industry. His innovative patents reflect his commitment to improving the reliability and efficiency of electronic devices. His contributions continue to influence advancements in semiconductor technology.

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