The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Sep. 29, 2011
Applicants:
Tomohiro Uno, Tokyo, JP;
Takashi Yamada, Iruma, JP;
Atsuo Ikeda, Iruma, JP;
Inventors:
Assignee:
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); B23K 20/00 (2006.01); H01L 23/00 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); H01L 25/0657 (2013.01); H01L 2924/01024 (2013.01); B23K 20/007 (2013.01); H01L 2224/76268 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/45664 (2013.01); H01L 2924/01327 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/45644 (2013.01); H01L 2225/0651 (2013.01); H01L 2224/48799 (2013.01); H01L 2924/01045 (2013.01); H01L 2224/45565 (2013.01); H01L 2924/01006 (2013.01); H01L 2224/32145 (2013.01); H01L 2924/01078 (2013.01); H01L 2224/45669 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/48599 (2013.01); H01L 24/43 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/781 (2013.01); H01L 2224/4851 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01015 (2013.01); H01L 2224/85045 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4845 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/05624 (2013.01); H01L 24/85 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/73265 (2013.01); H01L 24/48 (2013.01); H01L 23/48 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45015 (2013.01); H01L 2924/12041 (2013.01); H01L 24/78 (2013.01); H01L 2224/45639 (2013.01); H01L 2225/06565 (2013.01); H01L 24/45 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/43 (2013.01); H01L 2924/00015 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/85205 (2013.01);
Abstract
A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion.