The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Jul. 24, 2008
Tomohiro Uno, Tokyo, JP;
Keiichi Kimura, Tokyo, JP;
Shinichi Terashima, Tokyo, JP;
Takashi Yamada, Iruma, JP;
Akihito Nishibayashi, Iruma, JP;
Tomohiro Uno, Tokyo, JP;
Keiichi Kimura, Tokyo, JP;
Shinichi Terashima, Tokyo, JP;
Takashi Yamada, Iruma, JP;
Akihito Nishibayashi, Iruma, JP;
Nippon Steel Materials Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Iruma, JP;
Abstract
It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition. The outer layer is 0.021 to 0.12 μm in thickness.