The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Nov. 12, 2020
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Tetsuya Oyamada, Tokyo, JP;
Tomohiro Uno, Tokyo, JP;
Daizo Oda, Saitama, JP;
Motoki Eto, Saitama, JP;
Takumi Ohkabe, Saitama, JP;
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo, JP;
NIPPON MICROMETAL CORPORATION, Saitama, JP;
Abstract
An object of the present invention is to provide an Ag alloy bonding wire for a semiconductor device capable of extending the high-temperature life of a wire, reducing chip damage during ball bonding, and improving characteristics such as ball bonding strength in applications of on-vehicle memory devices. The Ag alloy bonding wire for a semiconductor device according to the present invention contains one or more of In and Ga for a total of 110 at ppm or more and less than 500 at ppm, and one or more of Pd and Pt for a total of 150 at ppm or more and less than 12,000 at ppm, and a balance being made up of Ag and unavoidable impurities.