Artur Kolics

This inventor holds 60 USPTO granted patents and 14 published patent applications and 1 EPO patent, primarily in Semiconductor Metallization (CPC class H01L). Top assignees: Lam Research Corporation, Blue29 Corporation, Kla-Tencor Technologies Corporation. Active years: 2004-2021.

USPTO Granted Patents = 60 (Patent Applications = 14)

% Patents Active = 78.3

EPO Patents = 1 (Patent Applications = 3)

Average Co-Inventor Count = 2.3

ph-index = 12

Forward Citations = 732(Granted Patents)

Forward Citations (Not Self Cited) = 668(Dec 10, 2025)

Inventors with similar research interests:

Location History:

San Jose, CA (US) (2004 - 2014)
Fremont, CA (US) (2013 - 2015)
Dublin, CA (US) (2007 - 2019)
Lake Oswego, OR (US) (2020 - 2021)

Company Filing History:

52 out of 3,928

Lam Research Corporation

Kla-Tencor Technologies Corporation

patents

4. 1 out of 285

Mattson Technology, Inc

patents

Years Active: 2004-2021

Loading Chart...

Areas of Expertise:

Vacuum-Integrated Hardmask

Electroless Plating

Wafer Cleaning

Interlevel Conductor

Copper Interconnect

Metallization

Selective Barrier Deposition

Atomic Layer Etching

Two-Step Deposition

Gapfill Metals

Through Silicon Via

Adhesion Layer

60 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11209729 - Vacuum-integrated hardmask processes and apparatus (2021-12-28),

2. 10831096 - Vacuum-integrated hardmask processes and apparatus (2020-11-10),

3. 10514598 - Vacuum-integrated hardmask processes and apparatus (2019-12-24),

4. 10262943 - Interlevel conductor pre-fill utilizing selective barrier deposition (2019-04-16),

5. 10103056 - Methods for wet metal seed deposition for bottom up gapfill of features (2018-10-16),

6. 10079207 - Metallization of the wafer edge for optimized electroplating performance on resistive substrates (2018-09-18),

7. 10049921 - Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor (2018-08-14),

8. 9875968 - Interlevel conductor pre-fill utilizing selective barrier deposition (2018-01-23),

9. 9837312 - Atomic layer etching for enhanced bottom-up feature fill (2017-12-05),

10. 9818617 - Method of electroless plating using a solution with at least two borane containing reducing agents (2017-11-14),

11. 9778561 - Vacuum-integrated hardmask processes and apparatus (2017-10-03),

12. 9768063 - Dual damascene fill (2017-09-19),

13. 9761524 - Metallization of the wafer edge for optimized electroplating performance on resistive substrates (2017-09-12),

14. 9691622 - Pre-fill wafer cleaning formulation (2017-06-27),

15. 9583386 - Interlevel conductor pre-fill utilizing selective barrier deposition (2017-02-28),

Title: The Innovative Journey of Artur Kolics

Introduction: Artur Kolics is a visionary inventor based in Dublin, CA, known for his groundbreaking contributions to various technological fields.

Latest Patents: Artur Kolics holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise.

Career Highlights: With a background in engineering and a passion for problem-solving, Artur Kolics has led numerous successful projects that have revolutionized industries and improved people's lives.

Collaborations: Throughout his career, Artur Kolics has collaborated with leading research institutions, universities, and tech companies to bring his innovative ideas to fruition, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Artur Kolics continues to push the boundaries of innovation, inspiring the next generation of inventors with his creative thinking and relentless pursuit of excellence.