The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Dec. 08, 2016
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Artur Kolics, Dublin, CA (US);

Praveen Nalla, Fremont, CA (US);

Xiaomin Bin, San Jose, CA (US);

Nanhai Li, Pleasanton, CA (US);

Yaxin Wang, Fremont, CA (US);

Patrick Little, Brentwood, CA (US);

Marina Polyanskaya, Morgan Hill, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/288 (2006.01); C23C 18/34 (2006.01); C23C 18/16 (2006.01); C23C 18/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); C23C 18/1637 (2013.01); C23C 18/34 (2013.01); C23C 18/50 (2013.01);
Abstract

A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.


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