The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Jul. 31, 2017
Lam Research Corporation, Fremont, CA (US);
Artur Kolics, Dublin, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A substrate having at least one device; wherein the substrate having a conductive layer disposed on a top surface of the substrate, the top surface having an edge exclusion region defined as an annular area that extends to an edge of the substrate, the top surface of the substrate further having a process region defined as a central area of the substrate that extends to about the annular area; wherein the substrate having a metallic material deposited over the conductive layer at the edge exclusion region, wherein a thickness of the metallic material reduces electrical resistance of the metallic material at the edge exclusion region; wherein the thickness of the metallic material and resulting reduced electrical resistance for an applied electrical current to the metallic material facilitates increasing a rate at which the process region is plated as a result of the applied electrical current and an applied electroplating solution.