The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Mar. 31, 2015
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventor:

Artur Kolics, Dublin, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/288 (2006.01); C11D 1/88 (2006.01); C11D 3/20 (2006.01); C11D 3/04 (2006.01); H01L 21/02 (2006.01); C11D 3/00 (2006.01); C11D 3/06 (2006.01); C11D 3/24 (2006.01); C11D 3/34 (2006.01); C11D 3/36 (2006.01); C11D 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); C11D 1/88 (2013.01); C11D 3/0073 (2013.01); C11D 3/042 (2013.01); C11D 3/06 (2013.01); C11D 3/2075 (2013.01); C11D 3/2082 (2013.01); C11D 3/245 (2013.01); C11D 3/3409 (2013.01); C11D 3/361 (2013.01); C11D 3/362 (2013.01); C11D 11/0047 (2013.01); H01L 21/02052 (2013.01);
Abstract

A pre-fill solution for application onto a substrate surface prior to a fill operation is provided, the fill operation defined by application of an electroless deposition solution onto the substrate surface to deposit a metallic material in an etched feature, the substrate surface having metallic contaminants generated from an etch operation that generated the etched feature in the substrate surface, the pre-fill solution effective for preventing the electroless deposition solution from depositing on the metallic contaminants, the pre-fill solution comprising: a surfactant, the surfactant configured to enhance wetting of the substrate surface, the concentration of the surfactant in the solution being approximately in the range of 10 ppm to 2000 ppm, wherein the surfactant is an amphoteric surfactant; oxalic acid dihydrate; and hypophosphorous acid as a pH adjusting agent configured to reduce the pH of the solution to approximately less than 2 during the application onto the substrate surface.


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