The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

May. 06, 2016
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventor:

Artur Kolics, Dublin, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 21/02 (2006.01); C25D 7/00 (2006.01); C23C 18/16 (2006.01); C25D 5/02 (2006.01); H01L 21/3205 (2006.01); H01L 21/321 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); H01L 21/67 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); C23C 18/161 (2013.01); C23C 18/163 (2013.01); C23C 18/1633 (2013.01); C25D 5/02 (2013.01); C25D 7/00 (2013.01); H01L 21/02021 (2013.01); H01L 21/288 (2013.01); H01L 21/2885 (2013.01); H01L 21/3212 (2013.01); H01L 21/32051 (2013.01); H01L 21/6723 (2013.01); H01L 21/76843 (2013.01); H01L 21/76873 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H01L 23/53209 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01);
Abstract

A system for electroless deposition on a substrate is provided, including the following: a chamber; a substrate support configured to receive a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region and a process region, wherein the substrate support is configured to rotate the substrate; a solution container configured to hold an electroless deposition solution; a dispenser configured to provide a flow of the electroless deposition solution; a controller, the controller configured to direct the flow of the electroless deposition solution toward the edge exclusion region while the substrate is rotated, the flow being directed away from the process region, the electroless deposition solution plates metallic material over the conductive layer at the edge exclusion region, to produce an increased thickness of the metallic material that reduces electrical resistance.


Find Patent Forward Citations

Loading…