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Guangdong, China

Zhuhai Access Semiconductor Co., Ltd

USPTO Granted Patents = 35

Forward Citations = 0

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27 inventors (with patents filed for the assignee):

Benxia Huang (33 out of 34 patents)

Lei Feng (31 out of 47 patents)

Xianming Chen (26 out of 74 patents)

4. Yejie Hong (13 out of 13 patents)

5. Wenshi Wang (13 out of 13 patents)

6. Jindong Feng (8 out of 8 patents)

7. Bingsen Xie (7 out of 7 patents)

8. Xianming Chen (7 out of 8 patents)

9. Lina Jiang (5 out of 5 patents)

10. Gao Huang (3 out of 3 patents)

11. Jian Peng (2 out of 12 patents)

12. Jida Zhang (2 out of 2 patents)

13. Jun Gao (2 out of 2 patents)

14. Min Gu (2 out of 2 patents)

15. Dror Hurwitz (2 out of 44 patents)

35 patents: Sort by Forward Citations

1. 12476230 - Embedded packaging structure and method for manufacturing the same (2025-11-18),

2. 12463055 - Package substrate manufacturing method (2025-11-04),

3. 12451447 - Substrate embedded with integrated inductor and manufacturing method thereof (2025-10-21),

4. 12418988 - Inductor-integrating embedded support frame and substrate, and manufacturing method thereof (2025-09-16),

5. 12412843 - Support frame structure and manufacturing method thereof (2025-09-09),

6. 12402414 - Capacitor and inductor embedded structure and manufacturing method therefor, and substrate (2025-08-26),

7. 12302508 - Temporary carrier and method for manufacturing coreless substrate thereby (2025-05-13),

8. 12300576 - Cyclic cooling embedded packaging substrate and manufacturing method thereof (2025-05-13),

9. 12279377 - Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same (2025-04-14),

10. 12278227 - Hybrid embedded packaging structure and manufacturing method thereof (2025-04-14),

11. 12230581 - Multi-device graded embedding package substrate and manufacturing method thereof (2025-02-18),

12. 12148676 - Embedded chip package and manufacturing method thereof (2024-11-19),

13. 12074115 - Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate (2024-08-27),

14. 12040526 - Method for manufacturing embedded package structure having air resonant cavity (2024-07-16),

15. 12040272 - Connector for implementing multi-faceted interconnection (2024-07-16),

Zhuhai Access Semiconductor Co., Ltd is a leading semiconductor manufacturing company based in Zhuhai, China. With a focus on innovation and quality, Access Semiconductor specializes in the design, development, and production of a wide range of integrated circuits and semiconductor devices. Their products are widely used in industries such as automotive, consumer electronics, telecommunications, and industrial automation. Access Semiconductor's commitment to customer satisfaction and continuous improvement has earned them a strong reputation in the semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

35 Patents

#38 in Guangdong

#809 in China

#18,581 in the World

Guangdong, China

Zhuhai Access Semiconductor Co., Ltd

Forward Citations = 0

27 inventors:

Benxia Huang (33 out of 34 patents)

Lei Feng (31 out of 47 patents)

Xianming Chen (26 out of 74 patents)

4. Yejie Hong (13 out of 13 patents)

5. Wenshi Wang (13 out of 13 patents)

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