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For the Inventor, By the Inventor

Guangdong, China

Zhuhai Access Semiconductor Co., Ltd

Calculating rank
USPTO Granted Patents = 35

Forward Citations = 1

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27 inventors (with patents filed for the assignee):

goldMedal Benxia Huang (33 out of 55 patents)

silverMedal Lei Feng (31 out of 62 patents)

bronzeMedal Xianming Chen (26 out of 74 patents)

4.  Yejie Hong (13 out of 14 patents)

5.  Wenshi Wang (13 out of 13 patents)

6.  Jindong Feng (8 out of 8 patents)

7.  Bingsen Xie (7 out of 7 patents)

8.  Xianming Chen (7 out of 29 patents)

9.  Lina Jiang (5 out of 5 patents)

10.  Gao Huang (3 out of 19 patents)

11.  Jian Peng (2 out of 12 patents)

12.  Jida Zhang (2 out of 2 patents)

13.  Jun Gao (2 out of 2 patents)

14.  Min Gu (2 out of 2 patents)

15.  Dror Hurwitz (2 out of 45 patents)


Core Competencies:
Embedded Packaging
Substrate Manufacturing
Integrated Inductor
Heat Dissipation
Hybrid Packaging
Cavity Substrate
Conductive Substrate
Multi-Device Embedding
Passive Device Packaging
Connector Design
3D Packaging
Electromagnetic Shielding

35 patents:

1. 12476230 - Embedded packaging structure and method for manufacturing the same (2025-11-18),
2. 12463055 - Package substrate manufacturing method (2025-11-04),
3. 12451447 - Substrate embedded with integrated inductor and manufacturing method thereof (2025-10-21),
4. 12418988 - Inductor-integrating embedded support frame and substrate, and manufacturing method thereof (2025-09-16),
5. 12412843 - Support frame structure and manufacturing method thereof (2025-09-09),
6. 12402414 - Capacitor and inductor embedded structure and manufacturing method therefor, and substrate (2025-08-26),
7. 12302508 - Temporary carrier and method for manufacturing coreless substrate thereby (2025-05-13),
8. 12300576 - Cyclic cooling embedded packaging substrate and manufacturing method thereof (2025-05-13),
9. 12279377 - Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same (2025-04-14),
10. 12278227 - Hybrid embedded packaging structure and manufacturing method thereof (2025-04-14),
11. 12230581 - Multi-device graded embedding package substrate and manufacturing method thereof (2025-02-18),
12. 12148676 - Embedded chip package and manufacturing method thereof (2024-11-19),
13. 12074115 - Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate (2024-08-27),
14. 12040526 - Method for manufacturing embedded package structure having air resonant cavity (2024-07-16),
15. 12040272 - Connector for implementing multi-faceted interconnection (2024-07-16),
Company Overview
Zhuhai Access Semiconductor Co., Ltd specializes in the development and manufacturing of semiconductor products, focusing on integrated circuits and related technologies. The company is known for its innovative solutions in the fields of consumer electronics, telecommunications, and industrial applications. Based in Guangdong, China, Access Semiconductor is committed to advancing semiconductor technology to meet the evolving demands of various industries, emphasizing quality and performance in its product offerings.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Nov 10 2026

35 Patents

#11 in Guangdong

#900 in China

#19,220 in the World

Guangdong, CN
Guangdong, China

Zhuhai Access Semiconductor Co., Ltd

Forward Citations = 1

27 inventors:

goldMedal Benxia Huang (33 out of 55 patents)

silverMedal Lei Feng (31 out of 62 patents)

bronzeMedal Xianming Chen (26 out of 74 patents)

4.  Yejie Hong (13 out of 14 patents)

5.  Wenshi Wang (13 out of 13 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Zhuhai Access Semiconductor Co., Ltd. Retrieved from https://idiyas.com/company/zhuhai-access-semiconductor-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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