This inventor holds 7 USPTO granted patents and 1 published patent application. Top assignee: Zhuhai Access Semiconductor Co., Ltd. Active years: 2022-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Guangdong, CN (2022)
- Zhuhai, CN (2022 - 2024)
Company Filing History:
Years Active: 2022-2025
Title: **Bingsen Xie: Innovator in Heat Dissipation and Electromagnetic Shielding Technologies**
Introduction
Bingsen Xie is a prominent inventor based in Guangdong, China, recognized for his significant contributions to the field of semiconductor packaging technologies. With five patents to his name, Xie has developed innovative solutions that enhance device performance and reliability in electronic applications.
Latest Patents
Among his latest contributions, Xie has introduced a novel heat dissipation-electromagnetic shielding embedded packaging structure, along with its manufacturing method and substrate. This advanced structure features a dielectric layer containing hollow cavity units and embedded electronic elements that significantly improve thermal management while providing electromagnetic shielding. The invention includes a metal layer that forms a shielding layer and circuit layer, offering enhanced protection and functionality.
Career Highlights
Bingsen Xie has made impactful strides in the semiconductor industry through his work with Zhuhai Access Semiconductor Co., Ltd. His expertise in the design and manufacturing of packaging structures has enabled the company to advance its technology offerings significantly. His five patents exemplify his commitment to innovation in the field.
Collaborations
Throughout his career, Xie has collaborated with talented professionals such as Lei Feng and Xianming Chen. Together, they work on cutting-edge technologies that push the boundaries of current applications and provide solutions to existing challenges in electronic device packaging.
Conclusion
Bingsen Xie's contributions to the field of heat dissipation and electromagnetic shielding showcase the importance of innovation in advancing technology. His patents not only demonstrate his ingenuity but also highlight the collaborative nature of research and development in the semiconductor industry. Xie's work continues to inspire future innovations in electronic materials and component design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile