Guangdong, China

Bingsen Xie


Average Co-Inventor Count = 5.3

ph-index = 1


Location History:

  • Guangdong, CN (2022)
  • Zhuhai, CN (2022 - 2024)

Company Filing History:


Years Active: 2022-2025

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7 patents (USPTO):

Title: **Bingsen Xie: Innovator in Heat Dissipation and Electromagnetic Shielding Technologies**

Introduction

Bingsen Xie is a prominent inventor based in Guangdong, China, recognized for his significant contributions to the field of semiconductor packaging technologies. With five patents to his name, Xie has developed innovative solutions that enhance device performance and reliability in electronic applications.

Latest Patents

Among his latest contributions, Xie has introduced a novel heat dissipation-electromagnetic shielding embedded packaging structure, along with its manufacturing method and substrate. This advanced structure features a dielectric layer containing hollow cavity units and embedded electronic elements that significantly improve thermal management while providing electromagnetic shielding. The invention includes a metal layer that forms a shielding layer and circuit layer, offering enhanced protection and functionality.

Career Highlights

Bingsen Xie has made impactful strides in the semiconductor industry through his work with Zhuhai Access Semiconductor Co., Ltd. His expertise in the design and manufacturing of packaging structures has enabled the company to advance its technology offerings significantly. His five patents exemplify his commitment to innovation in the field.

Collaborations

Throughout his career, Xie has collaborated with talented professionals such as Lei Feng and Xianming Chen. Together, they work on cutting-edge technologies that push the boundaries of current applications and provide solutions to existing challenges in electronic device packaging.

Conclusion

Bingsen Xie's contributions to the field of heat dissipation and electromagnetic shielding showcase the importance of innovation in advancing technology. His patents not only demonstrate his ingenuity but also highlight the collaborative nature of research and development in the semiconductor industry. Xie's work continues to inspire future innovations in electronic materials and component design.

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